The heatsinkcalculator offers online heat sink analysis software that allows you to analyze plate fins heat sinks cooled via radiation and natural or forced convection.
Aluminium heat sink calculator.
Or select a value from our material database.
A reference link has been placed below the calculator for further reading.
In our experience it generally estimates the overall heat sink volume within 15 of a final design.
Heat sink thermal resistance delta t for each component part of the heat sink.
This tool is designed to calculate junction temperature of an electronic device typically power devices given four parameters.
This heat sink calculator compares heat sinks using a solid metal base to those using a vapor chamber base.
Multiple heat sources attached to the heat sink can be evaluated.
The heat transfer conduction calculator below is simple to use.
Calculate the thermal resistance and pressure drop of a plate fin heat sink and study how individual parameters affect the heat sink performance.
The width of the heat sink is then calculated based on the number of fins required to dissipate the heat from the heat sink.
Advanced tool to calculate thermal resistance pressure drop and base temperature of plate fin heat sinks with flow bypass and base spreading effects.
The formula to find the required thermal resistance of the heat sink given by jluciani is basically correct but is missing a term for the ambient temperature ta.
The heat sink size calculator is based on a well established equation for estimating heat sink volume during the early stages of heat sink design.
How does the heat transfer conduction calculator works.
Tj rjc rcs rsa pd ta where tj is the maximum target temperature of the junction.
The heat sink size calculator first calculates the optimum spacing between the fins to achieve maximum convection cooling.
Heat sink calculator is a tool for designing analysing and optimizing heat sink performance contact us today for custom heatsink solutions.
The equation should be.
How does the heat sink calculator work.
The maximum ambient temperature the device s junction to package thermal resistance the thermal resistance of the heat sink and the power applied.